Excelling in solderability and bondability in comparison to electroless nickel-phosphorus plating, electroless nickel-boron plating is used for electronic parts.
| Features (characteristic value) | |
|---|---|
| - Having good solder wettability and bondability, but inferior corrosion resistance in comparison to electroless nickel-phosphorus plating. - Ceramic substrates and IC packages |
Pb-free |
Nickel-boron binary phase diagram
| Electroless nickel-phosphorus | Electroless nickel-boron | |
|---|---|---|
| Alloy composition of plating film | 2 – 13 P wt% Amorphous (crystallized by heat treatment) |
0.3 – 1 B wt% Microcrystalline |
| Hardness (as-plated) | 500～700 | 700～800 |
| Magnetism | Non-magnetic (phosphorus 10% or more) Magnetic (phosphorus under 10%) |
Strongly magnetic |
| Internal stress | Low compressive stress – tensile stress | High tensile stress |
| Solderability | Normal | Good |
| Corrosion resistance and chemical resistance | Excellent | Normal |
Types of plating
Materials & uses
